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2020
Journal Article
Titel
Galvanische Aluminium-Abscheidung auf unterschiedlichen Startschichten für die Leiterplatten- und Mikrosystemtechnik (Teil 1)
Alternative
Galvanic deposition of aluminum on different seed layers for the printed circuit board and microsystem technology (Part 1)
Abstract
The production of thick Al layers at modelte temperatures is of great interest for many applications. In this paper the galvanic deposition ofaluminium for printed circuit board and microsystem technology is investigated. Influencing variables on the idyer morphology are represented by deposition on Silicon Substrates with a gold seed layer. The current density and the electrolyte temperature have a great influence on the microstructure of the layers produced. the deposition parameters evaluated for the gold seed layer cannot be transferred to an aluminium seed layer. Vias are very important for a functional printed circuit board. In this article different approachds for the coating of such through-hole contacts are presented. Furthermore, the structuring of the aluminium layers is described using photoresist including etching ofthe seed layer.