Options
2013
Conference Paper
Titel
Atmospheric pressure plasma pre-treatment of ALD-Al2O3 for low-temperature direct bonding
Titel Supplements
Abstract
Abstract
This paper presents results of investigations of the bonding behaviour of ALD-Al2O3 coated silicon wafers. Before bonding, the coated wafers were activated with atmospheric-pressure plasma to increase the bonding strength. Furthermore, the influence of plasma activation prior ALD-Al2O3 coating, and the effect of various ALD layer thickness was examinated.
Author(s)