Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Approach for a modular design methodology for an efficient development of 3D MID components

 
: Mager, T.; Jürgenhake, C.; Dumitrescu, R.

:

Franke, J. ; Institute of Electrical and Electronics Engineers -IEEE-:
14th International Congress Molded Interconnect Devices, MID 2021. Scientific Proceedings : February 8th-11th, 2021, virtual event
Piscataway, NJ: IEEE, 2021
ISBN: 978-1-7281-7510-2
ISBN: 978-1-7281-7509-6
S.39-47
International Congress Molded Interconnect Devices (MID) <14, 2021, Online>
Englisch
Konferenzbeitrag
Fraunhofer IEM ()

Abstract
In the context of ongoing digitalization, ever more powerful, smaller electronic devices are required. These devices are usually intended to communicate wirelessly and require a high integration density for embedding in devices. With existing circuit board technologies these systems can be successfully implemented today. In the context of industrial IoT (Internet of Things), which increasingly demands individualized or customized solutions, these technologies are no longer fully suitable. Since these technologies require a high development effort as well as a complex and expensive manufacturing technology. As a result, these development and manufacturing processes are only economically interesting for high volumes in order to spread the high costs for development and set-up of the processes over many parts. Especially in a surrounding of Industrial Internet of Things (IIoT), many applications require shape adapted individual solutions in small quantities, e.g. retrofitting of existing machinery. In this area, MID technology offers plenty of potential for realising shape-adapted electronic devices with a high integration density. By using additive manufacturing processes, such as MID filament for fused deposition modelling, stereolithographic printing with subsequent coating with LDS lacquer or direct printing with a MID resin, these primary cost drivers can be eliminated. However, until now each MID component has been developed individually and the complete development cycle is performed repetitively for each new MID component. The complex 3D design process is a major obstacle to the efficient and costeffective development of MID products in small batch sizes. Against the background of the high complexity of the MID manufacturing process and the associated inherent sources of error, new development approaches are needed. The here presented approach for a modular design methodology for an efficient development of 3D MID components simplifies and standardises this process. The core of the methodology is based on the analysis of numerous electronic devices for a specific application, e.g. wireless sensors. The aim here is to identify the common functions and transfer them into corresponding function modules. Function modules are independent functional units that represent electrical functionalities. These modules can be connected to different circuit topologies. This approach describes the segmentation and identification of these function blocks, the spatial transfer of these modules, the numerical validation and the optimisation of these blocks and gives an outlook on the development methodology. The methodology supports and significantly shortens the development process of spatial circuit carriers and at the same time increases the functional reliability of the design through validated function modules.

: http://publica.fraunhofer.de/dokumente/N-637564.html