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2021
Conference Paper
Titel
Comparison of Analog and Noise Performance between Buried Channel versus Surface Devices in HKMG I/O Devices
Abstract
In this work buried channel devices were successfully integrated in HKMG. Analog, noise and reliability performance have been reported and compared to a surface device. The devices were processed to have the same VTsat for the nominal geometry of a corresponding surface device. Advantages and drawbacks of the two integrations are discussed and explained with the support of calibrated TCAD simulations.