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Photonic-electronic ultra-broadband signal processing: Concepts, devices, and applications

: Koos, Christian; Randel, Sebastian; Freude, Wolfgang; Zwick, Thomas; Scheytt, J.C.; Witzens, J.; Walther, Martin; Harter, Tobias; Ummethala, Sandeep; Kieninger, C.; Zwickel, H.; Marin-Palomo, P.; Muehlbrandt, Sascha; Füllner, C.; Schaefer, J.; Gudyriev, S.; Zazzi, A.; Müller, J.; Tessmann, Axel


Institute of Electrical and Electronics Engineers -IEEE-:
IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2020 : 16-19 November 2020, virtual
Piscataway, NJ: IEEE, 2020
ISBN: 978-1-7281-9750-0
ISBN: 978-1-7281-9749-4
3 S.
BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) <2020, Online>
Fraunhofer IAF ()
photonic integration; silicon photonic; plasmonics; hybrid integration; THz communication; Kramers-Kronig receiver

Combining photonic integrated circuits (PIC) with millimeter-wave electronics opens novel perspectives in generation and detection of ultra-broadband signals with disruptive potential for a wide variety of applications. Here, we will give an overview on our recent progress in the field of ultra-broadband photonic electronic signal processing, covering device concepts such as silicon plasmonic integration, signal processing concepts such as Kramers-Kronig-based phase reconstruction of THz signals, as well as application demonstrations in the field of high-speed wireless data transmission.