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Finite Element Analysis: A Tool for Investigation of Sharpness Changes in Automotive Cameras

 
: Pandey, Amit; Kühn, Stephan; Erdogan, Hüseyin; Schneider, Klaus; Elger, Gordon

:

Institute of Electrical and Electronics Engineers -IEEE-:
21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020 : 5-8 July 2020, Cracow, Poland, Virtual Event
Piscataway, NJ: IEEE, 2020
ISBN: 978-1-7281-6049-8
ISBN: 978-1-7281-6050-4
S.58-64
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <21, 2020, Online>
Englisch
Konferenzbeitrag
Fraunhofer IVI ()
finite element analysis; automotive cameras; sharpness; creep; solder interconnect

Abstract
This paper investigates the most common sources for Change in Sharpness (CIS) of an automotive camera system. Deformation related to mismatches in Coefficient of Thermal Expansion (CTE) and creep in the BGA-Solder interconnect has been identified as most important source of CIS. This paper focuses on the development of a Zero-Hour model for a later planned extensive thermal cycling simulation investigating CIS over system lifetime. The Model is based on a simplified camera module, simulated in the thermal operations window of the system. The Zero-Hour model includes the curing process of the adhesive, which accounts for residual deformation in the components during assembly. Using this as a baseline, temperature cycling was simulated to investigate creep in the solder interconnects.

: http://publica.fraunhofer.de/dokumente/N-630609.html