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Organosolv Lignin for Non-Isocyanate Based Polyurethanes (NIPU) as Wood Adhesive

: Saražin, Jasa; Pizzi, Antonio; Amirou, Siham; Schmiedl, Detlef; Sernek, Milan

Volltext urn:nbn:de:0011-n-6212952 (2.9 MByte PDF)
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Erstellt am: 14.1.2021

Journal of renewable materials : JRM 9 (2021), Nr.5, S.881-907
ISSN: 2164-6325 (Print)
ISSN: 2164-6341 (Online)
Zeitschriftenaufsatz, Elektronische Publikation
Fraunhofer ICT ()
Organosolv lignin; NIPU; MALDI ToF; FTIR; ABES

A non-isocyanate-based polyurethane (NIPU) wood adhesive was produced from organosolv lignin, which is a bio-sourced raw material, available in large quantities and produced as a by-product of the paper industry. The formulation of this new lignin-based NIPU adhesive, which is presented, was chemically characterised by Matrix-Assisted Laser Desorption Ionization Time of Flight (MALDI ToF) mass spectrometry and by Fourier Transform Infra-Red (FTIR) spectrometry analyses. The oligomers formed were determined and showed that the three species involved in the NIPU adhesive preparation were formed by the co-reaction of the three reagents used: lignin, dimethyl carbonate, and hexamethylene diamine. Linear and branched structures were both identified. Mechanical properties of the adhesive were determined using the Automated Bonding Evaluation System (ABES) and internal bond (IB) strength test of the laboratory particleboard bonded with it. The adhesive has shown satisfactory mechanical properties after hot pressing at 230°C. Such a temperature is used industrially in the most modern particleboard factories, but since it is hardly feasible for more conventional wood bonding equipment, the reactivity of the NIPU adhesive was successfully increased with the addition of a small percentage of a silane coupling agent. With the addition of the silane, the proposed NIPU adhesive could also be used at a hot-pressing temperature lower than 200°C.