Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Dispensing Technology Meets CIGS Substrates: First IV-Results with Dispensed Metal Grid on CIGS Mini-Modules

 
: Gensowski, K.; Jimenez, A.; Tepner, S.; Kuchler, M.; Breitenbücher, M.; Freund, T.; Köder, P.; Müller, J.; Dimmler, B.; Pospischil, M.; Clement, F.

:
Volltext urn:nbn:de:0011-n-6181630 (846 KByte PDF)
MD5 Fingerprint: 9be4953e26518363978aade845d1a567
Erstellt am: 11.12.2020


Pearsall, Nicola (ed.):
37th European Photovoltaic Solar Energy Conference and Exhibition, EU PVSEC 2020 : 07-11 September 2020, Online Conference
München: WIP, 2020
ISBN: 3-936338-73-6
S.636-640
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) <37, 2020, Online>
Englisch
Konferenzbeitrag, Elektronische Publikation
Fraunhofer ISE ()
Photovoltaik; Silicium-Photovoltaik; Metallisierung und Strukturierung

Abstract
For the first time, the parallel dispensing approach and the CIGS thin-film technology are combined to demonstrate metallization for thin-film PV with low temperature pastes. This article focuses on dispensing three different low temperature pastes through 35 μm and 25 μm nozzle openings, respectively, and applying them on 156 mm x 156 mm CIGS substrates. The screen printed metal grid acts as reference. The achieved contact resistivity values are below 5 mcm². The metal grid on the TCO layer of CIGS substrates obtains an increased short-circuit current density of jsc = 1.1 mA∙cm-², which corresponds to 3.5% current density gain compared to grid-free CIGS modules, and an increased module power of up to 4.6%. Additionally, the Fill Factor is positively affected by the metallization. Paste C shows a promising contact finger geometry with a core finger width of wcore = 25 μm ± 1 μm and an optical aspect ratio of ARo= 0.46 ± 0.02. Following, the dispensing technology has been successfully applied on CIGS mini-modules as a future approach for realizing the metallization with a realistic perspective in terms of scalability for large module sizes.

: http://publica.fraunhofer.de/dokumente/N-618163.html