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Future Packaging Technologies in Power Electronic Modules

Presentation held at Power Packaging Virtual Forum, 24.11.2020, Virtual
 
: Bayer, Christoph Friedrich; Yu, Zechun; Bach, Hoang Linh; Müller, Jonas; Schletz, Andreas

:
Präsentation urn:nbn:de:0011-n-6157213 (2.0 MByte PDF)
MD5 Fingerprint: 12ee7257194bcfb8beada34619415235
Erstellt am: 3.12.2020


2020, 26 Folien
Power Packaging Virtual Forum <2020, Online>
Englisch
Vortrag, Elektronische Publikation
Fraunhofer IISB ()

Abstract
This paper summarizes power electronics packaging trends and technologies that were identified at the Fraunhofer IISB as promising in future. Due to upcoming demands including further integration, minimization, modularization, high temperature and high voltage capability, listed packaging topics are recently addressed and researched. Besides a deeper insight into three main topics, high switching speed by RC-snubber devices and high current copper projection welding are presented. Main topics are ceramic embedding by subtractive manufacturing processes for harsh environments and best semiconductor electrical interconnect, selective sintering of power electronic devices on organic circuit carriers for higher process flexibility, higher powers and long lifetime, as well as direct bonding without sinter or solder material as a novel interconnection technology in power electronics.

: http://publica.fraunhofer.de/dokumente/N-615721.html