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A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems

 
: Ndip, I.; Andersson, K.; Kosmider, S.; Le, T.H.; Kanitkar, A.; Dijk, M. van; Senthil Murugesan, K.; Maaß, U.; Löher, T.; Rossi, M.; Jaeschke, J.; Ostmann, A.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.

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Institute of Electrical and Electronics Engineers -IEEE-:
IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Proceedings : 3 - 30 June 2020, Orlando, Florida, Virtual
Los Alamitos, Calif.: IEEE Computer Society Conference Publishing Services (CPS), 2020
ISBN: 978-1-7281-6180-8
ISBN: 978-1-7281-6181-5
S.101-107
Electronic Components and Technology Conference (ECTC) <70, 2020, Online>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
In this work, we present a novel packaging and system-integration platform with integrated antennas (antenna-in-package, AiP, platform) for 5G millimeter-wave (mmWave) systems. We illustrate the application of the platform for the development of miniaturized, scalable, low-cost and high-performance 5G mmWave systems for new radio (NR) base stations. RF characterization of the dielectric material of the platform and the integrated mmWave antennas as well as thermal investigations of the platform are presented. The process steps required for the fabrication of the platform are discussed, and an example of a mmWave chip embedded in the platform is shown.

: http://publica.fraunhofer.de/dokumente/N-614662.html