Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Determining adhesion of critical interfaces in microelectronics - A reverse Finite Element Modelling approach based on nanoindentation. Part I

 
: Reuther, G.M.; Albrecht, J.; Pufall, R.; Dudek, R.; Rzepka, S.

:

Institute of Electrical and Electronics Engineers -IEEE-:
21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020 : 5-8 July 2020, Cracow, Poland, Virtual Event
Piscataway, NJ: IEEE, 2020
ISBN: 978-1-7281-6049-8
ISBN: 978-1-7281-6050-4
S.297-302
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <21, 2020, Online>
Englisch
Konferenzbeitrag
Fraunhofer ENAS ()

Abstract
In modern microelectronic devices, mechanical robustness and reliability have become more and more challenging, which is mainly due to continuous shrinkage of dimensions. At the same time a wide variety of thin film materials - metals, ceramics and glasses - are stacked and micro-structured for optimized device performance. Perfect adhesion of these thin film layers, even after exposure to thermal treatment or in presence of intrinsic stress, is crucial for device reliability. In particular, interfaces between isolating and metallization layers require careful assessment due to different bonding types of the materials involved.

: http://publica.fraunhofer.de/dokumente/N-614628.html