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Comparison of flip chip technologies on rigid polyimide with respect to reliability and manufacturing costs
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2000
Conference Paper
Titel
Comparison of flip chip technologies on rigid polyimide with respect to reliability and manufacturing costs
Author(s)
Mießner, R.
Aschenbrenner, R.
Reichl, H.
Ling, S.
Le, B.
Lew, A.
Benson, R.
Nhan, E.
Hauptwerk
ECTC 2000. Proceedings of the 50th Electronic Components & Technology Conference
Konferenz
Electronic Components and Technology Conference (ECTC) 2000
DOI
10.1109/ECTC.2000.853314
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM