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Introducing a Reference Flow for Chip-Package Co-Design for 5G / MM-Wave Designs on GF ADK for 22FDX

Presentation held at Cadence Live Europe 2020, Virtual Event, October 13-14, 2020
 
: Heinig, Andy; Hopsch, Fabian

:
Präsentation urn:nbn:de:0011-n-6060973 (1.7 MByte PDF)
MD5 Fingerprint: 554a9bb6b90149b9ee15cdbc0db2a7df
Erstellt am: 4.11.2020


2020, 21 Folien
Event "CadenceLIVE" <2020, Online>
Englisch
Vortrag, Elektronische Publikation
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

Abstract
This talk is presenting a reference flow for a chip-package co-design. The technology used, is a 22FDx IC-technology combined with a two-level package technology. The application case is data transfer at 60GHz for 5G. To cope with the requirements of such a system an Assembly Design Kit (ADK) is necessary to enable co-design.

: http://publica.fraunhofer.de/dokumente/N-606097.html