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Temperature Challenges for Integrated Systems due to High Power Density
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2020
Presentation
Title
Temperature Challenges for Integrated Systems due to High Power Density
Title Supplement
Presentation held at ECPE Tutorial Wide-Bandgap User Training, 22.09.2020, Berlin
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Author(s)
Schletz, A.
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Bayer, C.F.
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Hutzler, A.
Bond Pulse
Conference
Tutorial "Wide-Bandgap User Training" 2020
DOI
10.24406/publica-fhg-409034
File(s)
N-605676.pdf (3.86 MB)
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Rights
Under Copyright
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Keyword(s)
power semiconductors
DC-link capacitor
electrical insulation
die attach
high temperature
