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Investigation of micro stress in adhesive bonds in electro optics, and micro optics

 
: Gesang, T.; Zickwolf, R.; Friedsam, G.

:

TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-:
1st Electronics Systemintegration Technology Conference, ESTC 2006. Vol.1 : Dresden, 5.-7.9.2006
New York, NY: IEEE, 2006
ISBN: 1-4244-0552-1
ISBN: 1-4244-0533-X
S.532-539
Electronics Systemintegration Technology Conference (ESTC) <1, 2006, Dresden>
Englisch
Konferenzbeitrag
Fraunhofer IFAM ()

Abstract
Micro stress in adhesive bonds was analysed and optimised for 2 examples from electro optics, and micro optics. The investigative tools were various experiments on both, model joints and real joints, finite element modelling, and validation experiments. Micro stresses were found to influence both, manufacturing quality and ageing/reliability properties.

: http://publica.fraunhofer.de/dokumente/N-60563.html