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High Temperature Packaging for Sensor Elements

 
: Rebenklau, Lars; Gierth, Paul; Barth, Henry

PCIM Europe 2020, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. CD-ROM : 07.-08.07.2020 : proceedings
Berlin: VDE-Verlag, 2020
ISBN: 978-3-8007-5245-4
S.962-966
PCIM Europe Digital Days <2020, Online>
Bundesministerium fur Wirtschaft und Energie BMWi (Deutschland)
IGF; 19884 BR/1; HiTPack Plus
Englisch
Konferenzbeitrag
Fraunhofer IKTS ()
high temperature packaging; sensor element

Abstract
Many industrial measurement tasks are facing increasing environmental temperatures up to 600 °C. Development of such kind of high temperature sensors require availability of temperature stable sensor elements (semiconductors, crystals), measuring principles as well as their packaging in suitable housings. The classic assembling technology of electronic packaging is reaching its limits concerning technological processes, thermal parameters, but also concerning the assembly materials itself. Therefore, existing connection technologies need to be evaluated and developed for higher operating temperatures. First works related to suitable housings and possible wire connection technologies have been presented at PCIM 2019. Aim of this work is to report examinations, which are related to the assembling of senor elements and the mechanical behavior of their mounting joints up to 600 °C.

: http://publica.fraunhofer.de/dokumente/N-603176.html