Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser

 
: Fleischer, A.S.; Troppenz, U.; Hamacher, M.; John, W.

:

Microelectronics reliability 46 (2006), Nr.2-4, S.421-431
ISSN: 0026-2714
Englisch
Zeitschriftenaufsatz
Fraunhofer IZM ()

Abstract
The vertical coupling of active InP based ring resonators and passive feeding waveguides necessitates the use of a waferbonding technology in the fabrication process. The required bond material (BCB) has a low thermal conductivity and will strongly influence the operating temperature and thus the performance of the ring resonator through its insulating effect. A comprehensive thermal analysis of a proposed vertically coupled ring resonator of 50 µm outer radius is undertaken during the design phase to determine the thermal impact of: the design of the wafer bond, the design of the passivation layer and the optical power levels. Thermal abatement strategies for semiconductor lasers are presented.

: http://publica.fraunhofer.de/dokumente/N-60032.html