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Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems

: Frömel, J.; Billep, D.; Gessner, T.; Wiemer, M.


Bagdahn, J.:
Wafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004. Special Issue : 11 - 12 October 2004, Halle: Two-day Workshop on "Wafer Bonding for MEMS Technologies"
Berlin: Springer, 2006 (Microsystem technologies 12.2006,Nr.5)
Wafer-Bonding Workshop for MEMS Technologies (WBW-MEMS) <2004, Halle/Saale>
Konferenzbeitrag, Zeitschriftenaufsatz
Fraunhofer IZM ()
Fraunhofer ENAS ()

This paper describes the application of a new method to verify the pressure and sealing of cavities in micromechanical components. The new method makes it possible to measure the pressure and the sealing (through measuring the pressure over time) of smallest gasvolumes with the monitoring of the quality factor of integrated micromechanical resonant structures. An example is used that shows the complete process of fabricating such micro mechanical resonant structures to evaluate a bonded structure.