Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Wafer level encapsulation of microsystems using glass frit bonding
| Bagdahn, J.:
Wafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004. Special Issue : 11 - 12 October 2004, Halle: Two-day Workshop on "Wafer Bonding for MEMS Technologies"
Berlin: Springer, 2006 (Microsystem technologies 12.2006,Nr.5)
S.468-472 |
| Wafer-Bonding Workshop for MEMS Technologies (WBW-MEMS) <2004, Halle/Saale> |
|
| Englisch |
| Konferenzbeitrag, Zeitschriftenaufsatz |
| Fraunhofer IZM ()
Fraunhofer ENAS () |
Abstract
This paper gives an introduction to glass frit wafer bonding, which is an universally useable technology for encapsulation of microsystems, especially surface micromechanical sensors on wafer level. After a process description, some mechanical as well as electrical characteristics of glass frit bonded wafers are discussed and applications are shown.