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Laser polishing using ultrashort pulse laser

 
: Brenner, A.; Röther, L.; Osbild, M.; Finger, J.

:

Klotzbach, Udo (Ed.) ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Laser-based Micro- and Nanoprocessing XIV : 3-6 February 2020, San Francisco, California
Bellingham, WA: SPIE, 2020 (Proceedings of SPIE 11268)
ISBN: 978-1-5106-3299-8
ISBN: 978-1-5106-3300-1
Paper 112680P, 13 S.
Conference "Laser-Based Micro- and Nanoprocessing" <14, 2020, San Francisco/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer ILT ()

Abstract
As a result of laser ablation, a surface roughness Sa between 0.4 μm and 2μm is obtained on 3D structures that have to be polished afterwards to meet customer requirements. For that reason a laser polishing process using ultrashort pulse laser sources is investigated. Applying the polishing process immediately after laser structuring in the same setting simplifies the process chain and saves both time and money. The results reveal an improvement of the surface roughness from an initial grinded surface with 0.4 μm to 0.2 μm by ultrashort pulse laser polishing. The productivity measured by the area that can be processed per time (polishing rate) is with 12.15 cm2/min one order of magnitude higher than state of the art laser polishing using nanosecond pulsed lasers.

: http://publica.fraunhofer.de/dokumente/N-596046.html