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Finite element simulations of the cyclic elastoplastic behaviour of copper thin films

 
: Siska, F.; Forest, S.; Gumbsch, P.; Weygand, D.

:

Modelling and simulation in materials science and engineering 15 (2007), Nr.1, S.S217-S238
ISSN: 0965-0393
Englisch
Zeitschriftenaufsatz
Fraunhofer IWM ()
thin film; plasticity; cyclic loading; finite element method

Abstract
A large-scale computational and statistical strategy is presented to investigate the development of plastic strain heterogeneities and plasticity induced roughness at the free surface in multicrystalline films subjected to cyclic loading conditions, based on continuum crystal plasticity theory. The distribution of plastic strain in the grains and its evolution during cyclic straining are computed using the finite element method in films with different ratios of in-plane grain size and thickness, and as a function of grain orientation (grains with a { 1 1 1} or a { 0 0 1} plane parallel to the free surface and random orientations). Computations are made for 10 different realizations of aggregates containing 50 grains and one large aggregate with 225 grains. It is shown that overall cyclic hardening is accompanied by a significant increase in strain dispersion. The case of free-standing films is also addressed for comparison. The overall surface roughness is shown to saturate within 10 to 15 cycles. Plasticity induced roughness is due to the higher deformation of { 0 0 1} and random grains and due to the sinking or rising at some grain boundaries.

: http://publica.fraunhofer.de/dokumente/N-59485.html