Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Packaging and Package Design for AI at the Edge

Redaktionell betreuter Blogbeitrag auf https://semiengineering.com, March 12th, 2020
 
: Heinig, Andy

:
Volltext (HTML; )

Online im WWW, 2020
Englisch
Elektronische Publikation
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

Abstract
Why system architects need to be able to compare different design variants at an early stage with a high level of abstraction. Industrial applications will acquire significantly more data directly from machines in coming years. To properly handle this increase in data, it must already be prepared at the machine. The data of the individual sensors can be processed, or an initial data merger can take place here at the so-called “edge.” Algorithms and methods from the field of artificial intelligence increasingly are being employed for this. These require powerful and flexible hardware, and the development of this hardware requires both new packaging concepts and corresponding design tools.

: http://publica.fraunhofer.de/dokumente/N-593283.html