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Embedding of active and passive components into printed wiring boards

Presentation held at the IPC - Integrated Passive Components, Chelmsford, MA, USA, 03.-04.05.06
: Löher, T.; Neumann, A.; Vieroth, R.; Ostmann, A.; Reichl, H.

Volltext urn:nbn:de:0011-n-591459 (436 KByte PDF)
MD5 Fingerprint: e641d3c1f91206099dfbdbe3e00918af
Erstellt am: 04.07.2007

2006, 6 S.
International Conference on Embedded Technology <3, 2006, Chelmsford/Ma.>
Vortrag, Elektronische Publikation
Fraunhofer IZM ()

Developments of advanced electronic products and the exploitation of new application fields for microelectronic systems are increasingly accompanied by challenging physical requirements on the system. Examples are light weight for any kind of mobile system, as high as possible degree of miniaturization and robustness against chemicals and body liquids for medical implant systems, possible conformity with bend surfaces for applications in aerospace and automotive. Generally the trend towards further increase of function and component density in future electronic systems is from being saturated. On the other hand there is a considerable pressure to keep lower electronic systems prices. Embedding of active and passive components into build up layers of printed wiring boards has on the long term the potential to comply with both requirements at the same time. The European Union is funding two multinational technology development projects focussing on the embedding of chips and passive components into multilayer printed wiring boards. As examples for embedding of passive components electro less Ni(P) resistors and lamination and structuring of capacitors will be presented. For the passive components deposition control, sheet handling, trimming, lamination into build up layers and post lamination trimming options will be discussed. A technology for the embedding of active chips will be presented. The active chip is therefore thinned down to a thickness of 20 - 30 µm. The chip is then flip chip bonded onto the board wiring using ultra thin solder contacts and subsequently embedded into the laminate layer. The process flow, resulting interconnections and reliability of the systems under different loading conditions will be presented.