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  4. SiC Power Module with integrated RC-Snubber Design for Voltage Overshoot and Power Loss Reduction
 
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2020
Conference Paper
Title

SiC Power Module with integrated RC-Snubber Design for Voltage Overshoot and Power Loss Reduction

Abstract
The maximum voltage overshoot of SiC MOSFETs in power modules limits the switching speed of voltage source inverters in electric vehicles. As the efficiency increases with faster switching transitions, decreased commutation loop inductances allow higher switching speeds at same voltage overshoot level and extend the vehicle's range. In this research, a SiC power module including an integrated RC-snubber is designed to increase the switching speed at same voltage overshoot. The RC-snubber acts as a damped low inductance commutation loop filtering the switching transients and suppressing the ringing, whereas the low frequency components are filtered by the dc-link capacitor. To meet the target of increased system efficiency, the losses of all inverter components are analyzed for space-vector modulation (SVPWM).
Author(s)
Rettner, Cornelius
Chair of Power Electronics, Friedrich-Alexander University Erlangen-Nuremberg, Nuremberg, Germany
Schiedermeyer, Maximilian
Chair of Power Electronics, Friedrich-Alexander University Erlangen-Nuremberg, Nuremberg, Germany
Apelsmeier, Andreas
Chair of Power Electronics, Friedrich-Alexander University Erlangen-Nuremberg, Nuremberg, Germany
Heckel, Thomas  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Diepgen, Antonia
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Klische, Alexander
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Dirksen, Daniel  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
März, Martin  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Mainwork
CIPS 2020, 11th International Conference on Integrated Power Electronics Systems. Proceedings  
Conference
International Conference on Integrated Power Electronics Systems (CIPS) 2020  
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
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