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  4. Highly Integrated Switching Cell Design based on Copper Diamond Heat Spreader, 3D Printed Heat Sink and HTCC Logic Board
 
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2020
Conference Paper
Title

Highly Integrated Switching Cell Design based on Copper Diamond Heat Spreader, 3D Printed Heat Sink and HTCC Logic Board

Abstract
This paper introduces a new switching cell design approach. While state-of-the-art power modules utilize bond wires and DBC-substrate, the proposed switching cell design focuses upon the elimination of bond wires in the power-loop by using a high temperature co-fired ceramics (HTCC) board. Moreover, the coefficients of thermal expansion (CTE) of the SiC-MOSFETs and the copper heat-sink are adapted through integrated copper-diamond (Cu-C) buffer layers.
Author(s)
Sewergin, Alexander
Institute for Power Electronics and Electrical Drives (ISEA), RWTH Aachen University, Germany
Rittner, Martin
Robert Bosch GmbH, Renningen, Germany
Burghardt, Andreas
Robert Bosch GmbH, Renningen, Germany
Kriegel, Kai
Siemens AG, München, Germany
Mitic, Gerhard
Siemens AG, München, Germany
Zetterer, Thomas
Schott AG, Landshut, Germany
Hutsch, Thomas  
Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM  
Neumann, Albert
Austerlitz Electronic GmbH, Nürnberg, Germany
Simon, Flaviu-Bogdan
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Doncker, Rik W. de
Institute for Power Electronics and Electrical Drives (ISEA), RWTH Aachen University, Germany
Mainwork
CIPS 2020, 11th International Conference on Integrated Power Electronics Systems. Proceedings  
Conference
International Conference on Integrated Power Electronics Systems (CIPS) 2020  
Language
English
Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
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