Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Highly Integrated Switching Cell Design based on Copper Diamond Heat Spreader, 3D Printed Heat Sink and HTCC Logic Board
:
Sewergin, Alexander; Rittner, Martin; Burghardt, Andreas; Kriegel, Kai; Mitic, Gerhard; Zetterer, Thomas; Hutsch, Thomas; Neumann, Albert; Simon, Flaviu-Bogdan; Doncker, Rik W. de | Verband Deutscher Elektrotechniker e.V. -VDE-, Berlin:
CIPS 2020, 11th International Conference on Integrated Power Electronics Systems. Proceedings : March, 24 - 26, 2020, Berlin, Germany; CD-ROM
Berlin: VDE-Verlag, 2020 (ETG-Fachbericht 161)
ISBN: 978-3-8007-5225-6
ISBN: 978-3-8007-5226-3
ISBN: 3-8007-5225-5
S.397-402 |
| International Conference on Integrated Power Electronics Systems (CIPS) <11, 2020, Berlin> |
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| Englisch |
| Konferenzbeitrag |
| Fraunhofer IISB ()
Fraunhofer IFAM () |
Abstract
This paper introduces a new switching cell design approach. While state-of-the-art power modules utilize bond wires and DBC-substrate, the proposed switching cell design focuses upon the elimination of bond wires in the power-loop by using a high temperature co-fired ceramics (HTCC) board. Moreover, the coefficients of thermal expansion (CTE) of the SiC-MOSFETs and the copper heat-sink are adapted through integrated copper-diamond (Cu-C) buffer layers.