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A new development in dry grinding

 
: Tawakoli, Taghi; Westkämper, Engelbert; Rabiey, Mohammad

International Institution for Production Engineering Research -CIRP-, Paris; Univ. of Liverpool, Department of Engineering:
40th CIRP International Seminar on Manufacturing Systems 2007. CD-ROM : Liverpool, 30 May - 1 June, 2007
Liverpool, 2007
6 S.
International Seminar on Manufacturing Systems <40, 2007, Liverpool>
Englisch
Konferenzbeitrag
Fraunhofer IPA ()
grinding; CBN-Schleifen; grinding wheel; Schleifen; Schleifscheibe

Abstract
Between different machining processes, dry grinding is one of the most difficult processes because of the nature of chip formation in grinding. This paper presents some of the interesting results of the systematic research work which was done by the authors to make a step forward in pure dry grinding based on:
- The optimisation of the chip formation reduces the friction and rubbing in the process
- Process heat transfer without using coolant lubricant
Results focused on grinding forces and the corresponding heat generation. A new method is presented to reduce heat energy by special conditioning using a diamond dressing disc, for dressing of the CBN vitrified bond wheel, based on a new innovative concept. The results showed a drastic reduction in grinding forces with the same material removal rate compared to that of a normal process without conditioning, and no burning or workpiece surface damage were noted.

: http://publica.fraunhofer.de/dokumente/N-58763.html