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A platform approach towards hybrid photonic integration and assembly for communications, sensing, and quantum technologies based on a polymer waveguide technology

: Kleinert, Moritz; Nuck, Madeleine; Conradi, Hauke; Felipe, David de; Kresse, Martin; Brinker, Walter; Zawadzki, Crispin; Keil, Norbert; Schell, Martin

Postprint urn:nbn:de:0011-n-5868227 (723 KByte PDF)
MD5 Fingerprint: 06f462664c949ce313ec686313337566
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Erstellt am: 7.5.2020

Institute of Electrical and Electronics Engineers -IEEE-:
IEEE CPMT Symposium Japan, ICSJ 2019 : November 18 - 20, 2019, Kyoto, Japan
Piscataway, NJ: IEEE, 2019
ISBN: 978-1-7281-0978-7
ISBN: 978-1-7281-0979-4
IEEE CPMT Symposium Japan (ICSJ) <2019, Kyoto>
European Commission EC
H2020; 820474; UNIQORN
Affordable Quantum Communication for Everyone: Revolutionizing the Quantum Ecosystem from Fabrication to Application
European Commission EC
H2020; 780502; 3PEAT
3D Photonic integration platform based on multilayer PolyBoard and TriPleX technology for optical switching and remote sensing and ranging applications
Bundesministerium für Bildung und Forschung BMBF (Deutschland)
Forschungsfabrik Mikroelektronik Deutschland
Konferenzbeitrag, Elektronische Publikation
Fraunhofer HHI ()

We present functionalities of photonic integrated circuits and a generic assembly approach for their hybrid integration with other components in the polymer waveguide platform PolyBoard. In addition to standard integrated optics capabilities, the PolyBoard approach allows for the realization of flexible interconnects, the fabrication of multilayer waveguide structures with low intra-layer coupling losses, and the integration of bulk optical crystals in on-chip free-space sections. These functionalities enable PICs with applications ranging from communications, via sensing, to quantum technology. The semiautomated assembly process presented in the second part of this paper ensures the compatibility of all individual functionalities and the scalability of the developed approaches towards production.