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Innovative substrate technologies for new products

: Aschenbrenner, R.; Löher, T.; Ostmann, A.; Kallmayer, C.; Scheel, W.; Reichl, H.


Institute of Electrical and Electronics Engineers -IEEE-:
International Microsystems, Packaging, Assembly Conference Taiwan 2006 : Taipei, Taiwan, October 18-20, 2006
Piscataway, NJ: IEEE, 2006
ISBN: 1-4244-0734-6
ISBN: 1-4244-0735-4
4 S.
International Microsystems, Packaging, Assembly Conference <2006, Taipei, Taiwan>
Fraunhofer IZM ()

The overwhelming majority of all electronic systems available today, is in the inside based on a substrate, on which the individual components are placed. Until now the substrate has only been used for the provision of electronic connections and as mechanical support. However there are several attempts and necessity in the development of modern electronic products for the integration of further system functions into the substrate (e.g. audio/video-functions in mobile phones or intelligent sensor technology in medical products). As a consequence of this development, in the future the substrate will also play a decisive role in the sense of the extension of functionalities. The resulting packaging and the production processes form the basis for highest integrated systems in almost all fields of application. Therefore an essential aim is the development of a system technological platform, which contains thinned components, electrical, optical, thermal, mechanical and fluidic connection elements in a multifunctional substrate and at the same time can be produced at a low price.