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A high-efficiency broadband WR3 bond wire on-chip antenna

 
: Müller, D.; Schäfer, J.; Lipp, A.; Leuther, A.; Zwick, T.; Kallfass, I.

:

European Association on Antennas and Propagation -EurAAP-:
12th European Conference on Antennas and Propagation, EuCAP 2018 : 9-13 April 2018
London: IET, 2018
ISBN: 978-1-78561-816-1
ISBN: 978-1-78561-815-4
5 S.
European Conference on Antennas and Propagation (EUCAP) <12, 2018, London>
Englisch
Konferenzbeitrag
Fraunhofer IAF ()

Abstract
This paper presents the design of a bond wire antenna suitable for integration with high-speeds MMIC processes. The basic antenna consists of a λ 0 /4 long bond wire attached to the center conductor of a radio frequency contact pad. To enhance the radiation gain in the desired direction a reflector, realized by four additional bond wires, was added at a distance of λ 0 /4. A very good agreement between simulation and measurement was achieved. Efficient radiation in the frequency range 220 to 300 GHz with a maximum gain of 10.1 dBi at 260 GHz was verified by measurements. The measured half power beamwidth at the center frequency of 260 GHz is 15° and 84° in E-plane and H-plane, respectively. The simulations show a maximum efficiency of 88% at 240 GHz and above 65% over the full frequency range.

: http://publica.fraunhofer.de/dokumente/N-581792.html