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Can Bond Wires really be used as Antennas?

 
: Ndip, I.; Becker, K.F.; Brandenburger, F.; Le, T.H.; Huhn, M.; Bauer, J.; Koch, M.; Hempel, M.; Schneider-Ramelow, M.; Lang, K.-D.

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TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-:
7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings : 18th to 21st Sept. 2018, Dresden, Germany
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-6814-6
ISBN: 978-1-5386-6813-9
ISBN: 978-1-5386-6815-3
S.41-44
Electronic System-Integration Technology Conference (ESTC) <7, 2018, Dresden>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
We model, design, fabricate and measure bond wire antennas (BWAs) at mmWave frequencies, considering the impact of encapsulation and process variations which occur during fabrication. Our results reveal that BWAs can withstand the fabrication process, and retain their impedance and radiation characteristics, if properly designed. Therefore, we believe that bond wires can be used as antennas for the development of real-world wireless systems.

: http://publica.fraunhofer.de/dokumente/N-581476.html