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Roles and Requirements of Electronic Packaging in 5G

 
: Ndip, I.; Lang, K.-D.

:

TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-:
7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings : 18th to 21st Sept. 2018, Dresden, Germany
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-6814-6
ISBN: 978-1-5386-6813-9
ISBN: 978-1-5386-6815-3
S.337-341
Electronic System-Integration Technology Conference (ESTC) <7, 2018, Dresden>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
In this work, we illustrate the roles and requirements of packaging in the implementation of hybrid beamforming-based mmWave massive MIMO architectures for the development of 5G hardware modules and systems.

: http://publica.fraunhofer.de/dokumente/N-581474.html