Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Antenna integration technologies for 5G car-application

 
: Hopsch, F.; Heinig, A.

:

Surface Mount Technology Association -SMTA-; Institute of Electrical and Electronics Engineers -IEEE-:
International Wafer Level Packaging Conference, IWLPC 2018 : San Jose, CA, USA, October 23-25, 2018
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-944543-06-8
ISBN: 978-1-5386-9308-7
S.92-96
International Wafer Level Packaging Conference (IWLPC) <2018, San Jose/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

Abstract
The internet-of-things trend requires further progress in wireless transmission. The next generation of cellular mobile communications, the so called 5G, is on the way. The standards are defined and companies are working on first products. This 5G standard is required for an all-connected world in a wireless sense. It brings the capable performance with the necessary reduction of current consumption in relation to transmitted data. Furthermore real time transmission will enable new technologies like demanded for autonomous driving.

: http://publica.fraunhofer.de/dokumente/N-581429.html