Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Investigation of LeTID where we can Control it - Application of FZ Silicon for Defect Studies

: Niewelt, T.; Post, R.; Schindler, F.; Kwapil, W.; Schubert, M.C.

Postprint urn:nbn:de:0011-n-5781894 (297 KByte PDF)
MD5 Fingerprint: 69c417a79e0158dd37ca85e75dbbb1ee
Copyright AIP
Erstellt am: 3.3.2020

Poortmans, J. ; American Institute of Physics -AIP-, New York:
SiliconPV 2019, the 9th International Conference on Crystalline Silicon Photovoltaics : 8-10 April 2019, Leuven, Belgium
New York, N.Y.: AIP Press, 2019 (AIP Conference Proceedings 2147)
ISBN: 978-0-7354-1892-9
Art. 140006, 7 S.
International Conference on Crystalline Silicon Photovoltaics (SiliconPV) <9, 2019, Leuven>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer ISE ()
Photovoltaik; Silicium-Photovoltaik; Charakterisierung von Prozess- und Silicium-Materialien; defects; silicon; LeTID; lifetime

In this work we present results of a series of experiments to investigate the origin of the defects causing light and elevated temperature induced degradation (LeTID). It has been demonstrated that LeTID effects can be observed even in high purity monocrystalline silicon. The experiments are therefore performed on float-zone silicon and feature a variety of process schemes to test important hypotheses on LeTID and reproduce them under more defined conditions. Different surface passivation schemes based on aluminium oxide layers are combined with a designated hydrogenation treatment and subjected to different thermal processes on both p- and n-type wafers. The results on p-type wafers confirm several previous observations concerning, e.g., the influence of silicon nitride layers and the firing peak temperature. However, we do not observe a crucial influence of the specific firing temperature profile in the experiment. The investigated n-type wafers do not feature a typical LeTID behaviour but appear to be affected by the LeTID defect nonetheless. Firstly, we observe an improvement of the effective lifetime under LeTID testing conditions that is driven by an improvement of the bulk lifetime. Secondly, identical pattern are observed in lifetime images of n-type wafers directly after firing and of p-type wafers in the degraded state. These findings strongly indicate that LeTID defects can be present in the initial state of n-type wafers after firing.