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Power module platform for automotive reliability requirements

 
: Pavlicek, N.; Liu, C.; Loisy, J.-Y.; Salvatore, G.; Mohn, F.; Schuderer, J.; Apelsmeier, A.; Dresel, F.; Schletz, A.; Vater, S.

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Institute of Electrical and Electronics Engineers -IEEE-:
21st European Conference on Power Electronics and Applications, EPE 2019 ECCE Europe : 3-5 September 2019, Genova, Italy
Piscataway, NJ: IEEE, 2019
ISBN: 978-9-0758-1531-3
ISBN: 978-9-0758-1530-6
ISBN: 978-1-7281-2361-5
10 S.
European Conference on Power Electronics and Applications (EPE) <21, 2019, Genova>
Englisch
Konferenzbeitrag
Fraunhofer IISB ()

Abstract
This paper presents the design and reliability assessments of a novel power semiconductor module platform for the automotive powertrain. Solder-free interconnects enable superior reliability meeting future automotive requirements. Modules with heavy Cu wire bonding on sintered top plates show a strongly improved power cycling lifetime compared to standard Al wire bonding. However, new failure modes are observed for the fully sintered devices.

: http://publica.fraunhofer.de/dokumente/N-574892.html