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2019
Conference Paper
Title
Power module platform for automotive reliability requirements
Abstract
This paper presents the design and reliability assessments of a novel power semiconductor module platform for the automotive powertrain. Solder-free interconnects enable superior reliability meeting future automotive requirements. Modules with heavy Cu wire bonding on sintered top plates show a strongly improved power cycling lifetime compared to standard Al wire bonding. However, new failure modes are observed for the fully sintered devices.
Author(s)
Pavlicek, N.
ABB Switzerland Ltd., Corporate Research, Segelhofstrasse 1k, Baden-Dättwil, 5405, Switzerland
Liu, C.
ABB Switzerland Ltd., Corporate Research, Segelhofstrasse 1k, Baden-Dättwil, 5405, Switzerland
Loisy, J.-Y.
ABB Switzerland Ltd., Corporate Research, Segelhofstrasse 1k, Baden-Dättwil, 5405, Switzerland
Salvatore, G.
ABB Switzerland Ltd., Corporate Research, Segelhofstrasse 1k, Baden-Dättwil, 5405, Switzerland
Mohn, F.
ABB Switzerland Ltd., Corporate Research, Segelhofstrasse 1k, Baden-Dättwil, 5405, Switzerland
Schuderer, J.
ABB Switzerland Ltd., Corporate Research, Segelhofstrasse 1k, Baden-Dättwil, 5405, Switzerland