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Towards a methodology for analysis of interconnect structures for 3D-integration of micro systems

 
: Schneider, P.; Reitz, S.; Wilde, A.; Elst, G.; Schwarz, P.

IEEE Components, Packaging, and Manufacturing Technology Society; Institute of Electrical and Electronics Engineers -IEEE-:
Design, Test, Integration and Packaging of MEMS/MOEMS : Symposium on Design, Test, Integration and Packaging of MEMS / MOEMS, 25 - 27 April 2007, Stresa, Lago Maggiore, Italy
Grenoble: EDA Publishing, 2007
ISBN: 978-2-35500-000-3
S.162-168
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS <2007, Stresa>
Englisch
Konferenzbeitrag
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

Abstract
Functional aspects as well as the influence of integration technology on the system behavior have to be considered in the 3D integration design process of micro systems.Therefore, information from different physical domains has to be provided to designers. Due to the variety of structures and effects of different physical domains, efficient modeling approaches and simulation algorithms have to be combined. The paper describes a modular approach which covers detailed analysis with PDE solvers and model generation for system level simulation.

: http://publica.fraunhofer.de/dokumente/N-57443.html