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High-Temperature packaging for sensors

 
: Rebenklau, Lars; Gierth, Paul; Barth, Henry

MESAGO Messe Frankfurt GmbH, Stuttgart:
PCIM Europe 2019, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. CD-ROM : Nuremberg, 7-9 May 2019; Proceedings
Berlin: VDE-Verlag, 2019
ISBN: 978-3-8007-4938-6
S.987-993
PCIM Europe <2019, Nuremberg>
Bundesministerium fur Wirtschaft und Energie BMWi (Deutschland)
IGF; 19884 BR/1; HiTPack Plus
Englisch
Konferenzbeitrag
Fraunhofer IKTS ()
Hochtemperatur; Sensorik; packaging; electronic packaging; Sensorelement; Werkstoffpaarung; Montagetechnologie; Arbeitstemperatur; Umgebungstemperatur; technologischer Prozess

Abstract
Sensors are used industrially for a wide variety of measuring and testing tasks. Measuring in harsh environments is not only a challenge for the sensor element but for the package, too. At ambient temperatures up to 600 °C, the classic assembling technology of electronic packaging is reaching its limits. This concerns technological processes, thermal parameters and assembly materials. Therefore, existing connection technologies need to be evaluated when facing high operation temperatures. Based on the research results of this work, the existing connection technologies are either to be adapted for the high-temperature environment or even new ones based on new material combinations are to be developed. This paper focuses on the packaging of sensors operating at temperatures up to 600 °C. First results concerning the selection and the characterization of ceramic packages, as well as the mounting of the sensors, are presented.

: http://publica.fraunhofer.de/dokumente/N-572501.html