2019
Presentation
Title

Ceramic Embedding Technologies for High Temperature Power Electronics

Title Supplement
Presentation held at ECPE Workshop "Advanced Power Packaging - Power Modules 2.0", 09-10 October 2019, Hamburg, Germany
Other Title
Ceramic Embedding as Packaging Solution for Future Power Electronic Applications
Author(s)
Bach, Linh  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Yu, Zechun  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Conference
DOI
File(s)
Rights
Under Copyright
Language
English
Keyword(s)