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Surface treatment of gold bumps for thermocompression bonding with low temperature

 
: Fröhlich, Juliane; Dietrich, Lothar; Oppermann, Hermann; Lang, Klaus-Dieter

:

TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-:
7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings : 18th to 21st Sept. 2018, Dresden, Germany
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-6814-6
ISBN: 978-1-5386-6813-9
ISBN: 978-1-5386-6815-3
S.7-11
Electronic System-Integration Technology Conference (ESTC) <7, 2018, Dresden>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
Trials were made for thermocompression bonding of gold contacts with different geometries. Prior to bonding, the surfaces were mechanically planarized and activated by means of an atmospheric plasma. These treatments enabled excellent shear strengths (about 50MPa) after bonding at a temperature of 160°C and a pressure of 100 MPa for short bond times (10s).

: http://publica.fraunhofer.de/dokumente/N-568918.html