2019
Presentation
Title

Future Packaging Technologies in Power Electronic Modules

Title Supplement
Presentation held at ISAPP 2019, International Symposium on Advanced Power Packaging 2019, October 7&8, 2019, Osaka, Japan
Author(s)
Bayer, C.F.  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Conference
File(s)
Rights
Use according to copyright law
DOI
Language
English