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Concept of the 3rd Generation of Reliability for Electronic Smart Systems

 
: Gromala, P.; Dietz, F.; Rzepka, S.; Han, B.

:

Institute of Electrical and Electronics Engineers -IEEE-; International Electronics Packaging Society -IEPS-:
18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. Proceedings : May 28 - 31, 2019, Las Vegas, Nevada, USA
Piscataway, NJ: IEEE, 2019
ISBN: 978-1-72812-461-2
ISBN: 978-1-72812-460-5
ISBN: 978-1-72812-462-9
S.917-922
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) <18, 2019, Las Vegas/Nev.>
Bundesministerium für Bildung und Forschung BMBF (Deutschland)
16ES0832K; smartSTAR
Englisch
Konferenzbeitrag
Fraunhofer ENAS ()

Abstract
We present a novel approach for reliability assessment of the future electronic control units and smart systems. This concept of 3rd generation reliability is based on application of hybrid prognostics and health management concept for the future safety relevant electronic control modules. This approach requires development of additional sensors and detectors to be integrated into the functional electronic units so that the reaction based on a current state of health status of the electronics can be triggered on demand.

: http://publica.fraunhofer.de/dokumente/N-565629.html