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Interconnection of Silicon Heterojunction Solar Cells by Infrared Soldering - Solder Joint Analysis and Temperature Study

 
: Rose, A. de; Geipel, T.; Eberlein, D.; Kraft, A.; Nowottnick, M.

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Volltext urn:nbn:de:0011-n-5654858 (858 KByte PDF)
MD5 Fingerprint: e038f021c03632743dea00474b00d7d4
Erstellt am: 27.11.2019


36th European Photovoltaic Solar Energy Conference and Exhibition, EU PVSEC 2019 : Proceedings of the international conference held in Marseille, France, 09-13 September 2019
Marseille, 2019
ISBN: 3-936338-60-4
S.229-234
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) <36, 2019, Marseille>
Englisch
Konferenzbeitrag, Elektronische Publikation
Fraunhofer ISE ()
Photovoltaik; Photovoltaische Module und Kraftwerke; Modultechnologie; heterojunction; interconnection; modules; soldering

Abstract
Interconnection of silicon heterojunction (SHJ) solar cells by soldering is challenging due to the temperature sensitivity of the passivation layers. Within our study, we evaluate solder joints on SHJ solar cells interconnected by infrared (IR) soldering. We screen printed various low-temperature metallization pastes on industrial precursors and interconnected them with Sn60Pb40 coated Cu ribbons on an industrial IR stringer. For our analysis, we used a temperature profile for soldering according to the industrial standard of PERC cells (~240 °C, < 3 s). Adhesion after soldering was characterized by 90° peel tests, yielding improved values of 0.9 N/mm. Microstructural investigations reveal a defined Ag3Sn layer, indicating a proper metallurgical bond. With electrical characterizations at cell and module level, we show IR soldering to be feasible for the interconnection of SHJ solar cells. We built 3-cell-modules and measure a power degradation below 1.5 % after 200 temperature cycles (−40 °C/+85 °C). A successful interconnection is also shown by a cell-to-module power ratio of 98.8 % for a 60-cellmodule achieving 324 W.

: http://publica.fraunhofer.de/dokumente/N-565485.html