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Surface technology with cold microplasmas

: Klages, C.-P.; Hinze, A.; Lachmann, K.; Berger, C.; Borris, J.; Eichler, M.; Hausen, M. von; Zänker, A.; Thomas, M.


Cavaleiro, A.:
Highlights from the Tenth International Conference on Plasma Surface Engineering, PSE 2006 : Garmisch-Partenkirchen, Germany: Held from 10 to 15 September 2006
Weinheim: Wiley-VCH, 2007 (Plasma processes and polymers 4.2007, Nr.3)
International Conference on Plasma Surface Engineering (PSE) <10, 2006, Garmisch-Partenkirchen>
Konferenzbeitrag, Zeitschriftenaufsatz
Fraunhofer IST ()
AC barrier discharge; microelectromechanical system; MEMS; microdischarge; micropatterning; plasma polymerization; polymer modification; surface modification

Various new plasma-based surface technological processes are made feasible by localizing atmospheric-pressure discharges to predefined volumes with sub-millimeter linear dimensions. So-called Plasma Printing processes use cold discharges in microcavities formed temporarily by contacting a substrate with a suitably designed kind of plasma stamp. Aside from dielectric barrier discharges driven by mid-frequency (MF) AC voltages, cold microplasmas can also be sustained in arrangements without a dielectric barrier, if RF excitation is used. The modification or coating of internal surfaces in already sealed microfluidic systems promises the achievement of a wide range of physico-chemical surface properties which are difficult to attain by wet-chemical or low-pressure plasma processes. Using a proper electrode arrangement, the coating or modification can be localized to a selected segment of a microfluidic system.