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Advances with Resist-Free Copper Plating Approaches for the Metallization of Silicon Heterojunction Solar Cells

 
: Hatt, Thibaud; Bartsch, Jonas; Franzl, Yannick; Kluska, Sven; Glatthaar, Markus

:
Postprint urn:nbn:de:0011-n-5621714 (667 KByte PDF)
MD5 Fingerprint: 7a50b98c79b4318066848790e68e871c
Erstellt am: 1.11.2019


Tous, L. ; American Institute of Physics -AIP-, New York:
8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells 2019. Proceedings : 13-14 May 2019, Konstanz, Germany
Woodbury, N.Y.: AIP, 2019 (AIP Conference Proceedings 2156)
ISBN: 978-0-7354-1901-8
Art. 020010, 5 S.
Workshop on Metallization & Interconnection for Crystalline Silicon Solar Cells <8, 2019, Konstanz>
European Commission EC
H2020-Low-cost, low-carbon energy supply - Developing the next generation technologies of renewable electricity and heating/cooling; 727529; DISC
Double side contacted cells with innovative carrier-selective contacts
Englisch
Konferenzbeitrag, Elektronische Publikation
Fraunhofer ISE ()
Plating; silicon hetero junction solar cell; TCOs

Abstract
The metallization of silicon heterojunction (SHJ) solar cells by selective Cu electroplating without any resist-mask is in development. A thin multi-functional PVD Cu-Al stack is deposited to mask the ITO and to promote homogeneous current distribution for simultaneous bifacial plating. This investigation reviews different approaches to perform the Al-patterning – by printing of a metallic ink, laser metal transfer or selective metal etching – to produce a metal-seed susceptible to plate selectively against the self-passivated Al surface. This NOBLE – native oxide barrier layer for selective electroplated, metallization allows reaching a first promising efficiency of 20.0% on a full area SHJ solar cell with low contact resistivity to ITO. This simultaneous bifacial metallization features several advantages: low temperature processing, high metal conductivity of plated copper, no organic masking and low material costs (almost Ag free).

: http://publica.fraunhofer.de/dokumente/N-562171.html