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Driving with Chiplets

Redaktionell betreuter Blogbeitrag auf, 24.09.2019
: Heinig, Andy

Volltext (HTML; )

Online im WWW, 2019
Elektronische Publikation
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

New packaging approach will be an enabler for autonomous driving. The first examples of the upper class of vehicles that can drive autonomously on the highway already have arrived on the market or will be introduced to the market in the coming years. Travel on the highway was selected as the first application because the number of objects that have to be taken into account in front of, next to, and behind the vehicle is manageable. This means the required processing power can be estimated and is realizable with current high-performance computing platforms. If the processing power of such a platform is not sufficient, it can be cascaded. In contrast to autonomous driving on the highway, in complex environments such as in the city, significantly more objects must be detected. A new system architecture approach is required, and various options are available. Those range from complex systems-on-chip (SoCs) to new approaches from the packaging area, such as chiplets.