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Methodology for correlation of porosity and mechanical properties of silver sintered joints in electronics

 
: Metasch, René; Röllig, Mike; Knoch, Philip; Weinmann, Christian; Meier, Karsten

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Institute of Electrical and Electronics Engineers -IEEE-:
20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019 : Hannover, Germany 24 – 27 March 2019
Piscataway, NJ: IEEE, 2019
ISBN: 978-1-5386-8041-4
ISBN: 978-1-5386-8040-7
ISBN: 978-1-5386-8039-1
S.409-415
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <20, 2019, Hannover>
Englisch
Konferenzbeitrag
Fraunhofer IKTS ()

Abstract
This paper presents a methodology to investigate and correlate the influence of porosity of silver sintered interconnects, e.g. used in power electronics, with their thermo-mechanical deformation behaviour. The proposed methodology includes the development of a shear specimen coming with a single cylindrical shaped silver-sintered joint enabling high resolution deformation measurements, strain rate controlled shear tests and according finite element analysis.The methodology also includes the development and optimization of a customized mechanical test system which is optimized for the measuring of deformations in the sub-micro meter range at high forces up to 500 N ([1], [2]). Furthermore, a multi-level image processing approach was developed to determine the porosity distribution of cross-section images of silver sintered joints.

: http://publica.fraunhofer.de/dokumente/N-549728.html