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How to Realize Solar Cells with Laser Structured Plated Ni-Cu-Contacts with Excellent Adhesion and High Fill-Factors without Parasitic Plating

: Büchler, A.; Kluska, S.; Bartsch, J.; Grübel, B.; Brand, A.A.; Gutscher, S.; Glatthaar, M.


Institute of Electrical and Electronics Engineers -IEEE-:
Get energized with solar power. 44th IEEE Photovoltaic Specialists Conference : Washington, DC, June 25-30, 2017
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5090-5605-7
ISBN: 978-1-5090-5606-4
Photovoltaic Specialists Conference (PVSC) <44, 2017, Washington/DC>
Fraunhofer ISE ()
Solarzellen - Entwicklung und Charakterisierung; Hocheffiziente Siliciumsolarzellen und neuartige Prozesse; Photovoltaik; Silicium-Photovoltaik; Kontaktierung und Strukturierung; Plating; Haftung

Investigating modifications of the silicon/metal interface during the manufacturing process and the influence on properties of laser-structured Ni-Cu-plated contacts enabled optimizing the metallization process. The micro pattern induced by ultrashort pulsed lasers ensures adhesion even without nickel silicide formation. Minimizing growth of laser-induced and native oxide at the surface of the laser patterned contact openings before plating enables high fill-factors without HF-treatment before metal deposition. Skipping the wet-chemical treatment eliminates parasitic plating on precursors with defective ARC. Compared to the state-of-the-art plating sequence, the approach presented features less process steps and enables improved solar cell aesthetics.