Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz

: Curran, B.; Reyes, J.; Tschoban, C.; Höfer, J.; Grams, A.; Wüst, F.; Hutter, M.; Leiß, J.; Martínez-Vázquez, M.; Baggen, R.; Ndip, I.; Lang, K.-D.


IEEE transactions on components, packaging and manufacturing technology 8 (2018), Nr.7, S.1231-1240
ISSN: 2156-3950
ISSN: 2156-3985
Fraunhofer IZM ()

High-gain steerable antenna arrays in the K-, Ka-, and V-frequency bands have the potential to facilitate high-bandwidth satellite communication for a variety of applications. Copper-core printed circuit boards (PCBs) can offer a cost-effective integration platform for such systems by simultaneously addressing both the high frequency and thermal challenges. Integrating GaAs dies into test vehicles has shown that copper-core PCBs can be automatically assembled and provide high-frequency systems that show adequate reliability during thermal cycling. A single 60-GHz transmitter front end, designed to drive a single element of a phased array, with a 2-GHz bandwidth signal, composed of four GaAs dies, including a phase shifter, integrated onto a copper-core PCB produces an output power of -4 dBm and maintains an on-chip temperature under 51 °C.