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2018
Conference Paper
Titel
Bond strength and stability of solderjet bumping packaging technique for laser device miniaturization
Abstract
Laser based solder-bumping technique, known as solderjet, is a highly suited technology for building a miniaturized optical devices with strict demand for robustness and stability, such as laser devices for space applications. We investigate the bond strength and the impact of the soldering to the stress induced on the soldered component.