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New technology for joining of LTCC and polymer assemblies

: Franke, V.; Sonntag, F.; Richter, G.; Klotzbach, U.


TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-:
1st Electronics Systemintegration Technology Conference, ESTC 2006. Vol.2 : Dresden, 5.-7.9.2006
New York, NY: IEEE, 2006
ISBN: 1-4244-0552-1
ISBN: 1-4244-0553-X
Electronics Systemintegration Technology Conference (ESTC) <1, 2006, Dresden>
Fraunhofer IWS ()

The main focus of this article lies on the development of a novel joining technology for LTCC ceramic and polymer sub-assemblies utilising laser radiation. Technical processes and the latest results are presented as well as potential future applications. The developed joining process can be divided into two steps utilizing the same laser system: a surface modification of the joining partners and a thermal process that is melting a small portion of the polymer matrix that is being pressed into the roughness of the ceramic surface.