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Hier finden Sie wissenschaftliche Publikationen aus den FraunhoferInstituten. Application of a TSMFM planar3D fast integral equation solver for surface wave characterization of antenna arrays
 Institute of Electrical and Electronics Engineers IEEE: International Conference on Broadband Communication, Wireless Sensors and Powering, BCWSP 2017 : Jakarta, November 2223, 2017 Piscataway, NJ: IEEE, 2018 ISBN: 9781538628331 ISBN: 9781538628324 ISBN: 9781538628348 S.1116 
 International Conference on Broadband Communication, Wireless Sensors and Powering (BCWSP) <2017, Jakarta> 

 Englisch 
 Konferenzbeitrag 
 Fraunhofer FHR () 
Abstract
This contribution deals with a Thin stratified medium fast multipole (TSMFM) fast integral equation framework for the characterization of Planar3D structures consisting of planar metallizations combined with vertical components like probe feeds and other vertical interconnects (vias) and especially finite dielectric regions embedded in a multilayered environment. First formulations of this type of fast integral equation solvers were presented already in [2]. In a similar approach in [1],[3], a cumbersome decomposition in radiation and receiving patterns is performed, in contrast to this we use a generalized Green's function tensor containing all integrations with regard to the vertical directions leading to a more stringent and effective implementation. Together with the different Green's functions of the structure and the residue theorem as well as steepest descent path considerations, the radiated space domain fields and especially the fields of surface waves can be determined with very high accuracy but very low computational effort. With vertical volume polarization currents, the finite extend of the substrate can be modeled quite efficiently together with the parasitic radiation of the surface waves from the edges of the substrate. Together with impedance sheets and vias with resistors this can be used to reduce the surface wave effects within antenna arrays.